Method for manufacturing semiconductor device

ABSTRACT

A flagship line  1  includes a job shop environment and a flow shop environment where three different standalone processing apparatuses for different steps constitute the job shop environment and two different serial processing apparatuses constitute the flow shop environment. One of the two serial processing apparatuses as a first serial processing apparatus  8  consists of a die bonder  5 , a clean cure unit  6 , and a wire bonder  7  and sequentially performs die bonding, clean cure and wire bonding. The other or second serial processing apparatus  13  consists of a marking unit  9 , a cutting unit  10 , a testing unit  11 , and a visual inspection unit  12  and sequentially performs marking, lead cutting, testing, and visual inspection. The three standalone processing apparatuses are a dicing apparatus  2 , a molding apparatus  4 , and a visual inspection apparatus  3 . This not only minimizes the possibility of a stagnant flow of workpieces between steps but also substantially shortens the overall processing time.

TECHNICAL FIELD

[0001] The present invention relates to semiconductor devicemanufacturing techniques and more particularly to techniques which areuseful for a semiconductor device manufacturing method using a serialprocessing apparatus and a workpiece flow management system.

BACKGROUND ART

[0002] There are two types of semiconductor device manufacturingsystems: a job shop system and a flow shop system. In a job shop system,plural semiconductor device manufacturing apparatuses of a kind areinstalled for each step to assure a high operation rate. In a flow shopsystem, a series of different steps are connected in a serial processingapparatus so that the different steps are serially performed. (As acompromise between both, a modular system is also available.)

[0003] Semiconductor device manufacturing techniques for job shopprocess systems are disclosed in Japanese Unexamined Patent PublicationNo.181184/1996 and No. 237095/1995.

[0004] Japanese Unexamined Patent Publication No.181184/1996 describes atechnique for a job shop process system in which workpiece conveyanceand processing are carried out between processing apparatuses underdesign cycle time control and workpieces are freely conveyed betweenprocessing apparatuses.

[0005] Japanese Unexamined Patent Publication No.237095/1995 describes atechnique for a job shop process system in which there are pluralworking areas in each of which plural processing apparatuses of a kindare connected by a conveyor system, and workpieces are moved betweenprocessing apparatuses as if they were moved between several flow shops.

[0006] Among other related techniques is a technique disclosed byJapanese Unexamined Patent Publication No.145022/1999 which combinesflow shop and job shop manufacturing lines to perform various stepsefficiently. In this system, among a series of manufacturing steps, somesteps suitable for a flow shop system are arranged according to a flowshop layout and the other steps are arranged according to a job shoplayout.

[0007] Furthermore, Japanese Unexamined Patent Publication No.99111/2000describes a production control technique which is related topriority-based lot management. In this technique, a comparison is madein absolute priority between products in process and incoming productsto determine which products should be processed next.

[0008] However, the above-mentioned techniques do not include referenceto means to optimize the selection of processing apparatuses forprioritized/non-prioritized products, optimize the selection ofprocessing apparatuses for mass-produced products/small-lot products ordifferentiate process scheduling.

[0009] Besides, there is no reference to means to save labor required torearrange the processing line for product type change or in case of asystem failure, by using a loader unit effectively in a flow shop system(serial processing system).

[0010] An object of the present invention is to provide a semiconductordevice manufacturing method which substantially shortens the processingtime.

[0011] The above and other objects and novel features of the inventionwill be apparent from the following description taken in connection withthe accompanying drawings.

DISCLOSURE OF THE INVENTION

[0012] The present invention provides a method of manufacturing asemiconductor device having a manufacturing sequence including: a flowshop process of sequentially performing a series of plural differentsteps; and a job shop process of providing a plurality of processingapparatuses of a kind and concurrently performing processing ofdifferent conditions, wherein a process of the manufacturing sequence,at least either flow shop process or job shop process is performed andthe manufacturing sequence combines flow shop process and job shopprocess.

[0013] Furthermore, the present invention provides a method ofmanufacturing a semiconductor device having a manufacturing sequenceincluding: a flow shop process of sequentially performing a series ofplural different steps; and a job shop process of providing a pluralityof processing apparatuses of a kind and concurrently performingprocessing of different conditions, wherein in a process in themanufacturing sequence, either flow shop process or job shop process orboth are performed, and the manufacturing sequence combines flow shopprocess and job shop process, and a serial processing apparatus havingat least one loader unit is used for flow shop process.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014]FIG. 1 shows the general structure of a flagship line based on asemiconductor device manufacturing method as an embodiment of thepresent invention;

[0015]FIG. 2 shows the structure of a first serial processing apparatusin the flagship line shown in FIG. 1;

[0016]FIG. 3 shows the structure of a second serial processing apparatusin the flagship line shown in FIG. 1;

[0017]FIG. 4 is a top view showing the detailed structures of a testingunit and a visual inspection unit in the second serial processingapparatus shown in FIG. 3;

[0018]FIG. 5 shows an example of a line which combines the flagship lineshown in FIG. 1 and an existing line;

[0019]FIG. 6 is a processing capacity comparison diagram showingdifferent processing capacities of different processing apparatuses inthe flagship line shown in FIG. 5;

[0020]FIG. 7 is a scheduling diagram showing process time charts in theflagship and combination lines shown in FIG. 5;

[0021]FIG. 8 shows an example of a workpieces flow in the offline modein the combination line shown in FIG. 5;

[0022]FIG. 9(a) and FIG. 9(b) show other application examples of thefirst serial processing apparatus in the flagship line shown in FIG. 1;

[0023]FIG. 10 show another application example of the flagship lineshown in FIG. 1;

[0024]FIG. 11 is a manufacturing process flow diagram showing an exampleof an assembling process in the flagship line shown in FIG. 1; and

[0025]FIG. 12 is a sectional view showing an example of a product QFPassembled in the manufacturing process shown in FIG. 11.

BEST MODE FOR CARRYING OUT THE INVENTION

[0026] Basically, in the explanation of an embodiment given below,descriptions of equivalent or similar elements will not be repeated

[0027] A plurality of inventions will be described below in connectionwith an embodiment for the sake of simplicity, but it is obvious thatevery step is not essential for all inventions unless otherwisespecified.

[0028] In the explanation of an embodiment given below, descriptionswill be made separately of more than one section or embodiment whennecessary. However, these descriptions are not irrelevant to each otherunless otherwise specified; a description of one section or embodimentmay be, in part or in whole, a variation or a detailed or supplementaryversion of description of another.

[0029] In the explanation of an embodiment given below, even when aspecific numeric figure for an element (number of pieces, numeric value,quantity, range, etc.) is indicated, the element is not limited theretounless otherwise specified or theoretically limited thereto, and itsactual quantity or other numeric data may be above or below theindicated specific figure.

[0030] In the explanation of an embodiment given below, it is obviousthat its elements (including steps) are not always essential unlessotherwise specified or considered theoretically essential.

[0031] In the explanation of an embodiment given below, when the form orposition of an element is indicated, any other form or positionvirtually equivalent or similar to it is acceptable unless otherwisespecified or the form or position should be theoretically as indicated.The same can be true of the above-mentioned numeric data or range.

[0032] Next, a preferred embodiment of the present invention will bedescribed in detail referring to the accompanying drawings. In thedrawings, components with the same functions are designated with thesame reference numerals and their descriptions will not be repeated.

[0033] This embodiment concerns a manufacturing line for semiconductordevice assembly. Here, QFP (Quad Flat Package) 20 as shown in FIG. 12 istaken as an example of a semiconductor device. A flagship line 1(FIG. 1) as a manufacturing line for the QFP 20 will be explained.

[0034] The flagship line 1 includes various processing apparatuses(manufacturing machines) which match a manufacturing process flow shownin FIG. 11.

[0035] A major feature of the flagship line 1 is that it includes serialprocessing apparatuses, namely it combines serial processing apparatuseswith plural standalone processing apparatuses. The manufacturing line asshown in FIG. 1 and FIG. 5 according to this embodiment includes twodifferent serial processing apparatuses and three different standaloneprocessing apparatuses where the two different serial processingapparatuses each carry out flow shop process while job shop process iscarried out between the two serial processing apparatuses.

[0036] In other words, the three different standalone apparatuses areinstalled to perform their respective steps in a job shop environmentand the two different serial processing apparatuses are installed in aflow shop environment.

[0037] A job shop means a production process in which plural processingapparatuses of a kind are located in one place to assure a highoperation rate.

[0038] A flow shop means a production process in which a series ofdifferent steps are sequentially performed.

[0039] In the flagship line 1 shown in FIG. 1 and FIG. 5, a first serialprocessing apparatus 8, which is one of the above two serial processingapparatuses, consists of a die bonder 5, a clean cure unit 6, and a wirebonder 7 which are connected to perform die bonding, clean cure and wirebonding sequentially (flow shop process).

[0040] The other or second serial processing apparatus 13 consists of amarking unit 9, a cutting unit 10, a testing unit 11, and a visualinspection unit 12 which are connected to perform marking, lead cutting,testing, and visual inspection sequentially.

[0041] The three standalone processing apparatuses (job processingapparatuses) are respectively a dicing apparatus 2, a molding apparatus4 and a coating apparatus 3.

[0042] These apparatuses are used to take different steps as shown FIG.11 to assemble the QFP 20 (FIG. 12). The steps are semiconductor waferdicing (step S1), die bonding (step S2), clean cure (step S3), wirebonding (step S4), molding (step S5), coating (step S7), marking (stepS8), cutting/forming (step S9), testing (step S10), and visualinspection (step S11).

[0043] Particularly in assembling the QFP 20 (narrow pitch type)according to this embodiment, the step of dam bar cutting (step S6) istaken for lead frames before the step of coating (step S7).

[0044] The step of dam bar cutting may be performed during lead cuttingwork at the step of lead cutting/forming (step S9).

[0045] The flagship line 1 in this embodiment shares some processingapparatuses with an existing line 40, as illustrated in FIG. 5.

[0046] For example, the dicing apparatus 2 and the coating apparatus 3have far larger capacities than the other processing apparatuses and arecapable of coping with different product types, so their reservedcapacities are used for the existing line 40.

[0047] Although the molding apparatus 4 is used for the job shopprocess, its processing capacity should differ depending on the numberof products per mold and thus it is not shared with the existing line 40in this case.

[0048] As shown in FIG. 5, in addition to the dicing apparatus 2 andcoating apparatus 3 shared with the flagship line 1, the existing line40 includes standalone molding apparatuses 4, standalone die bonders 41,standalone clean cure units 42, standalone wire bonders 43, standalonemarking units 44, standalone cutting units 45, standalone testing units46, and standalone visual inspection units 47.

[0049] In each of the first serial processing apparatus 8 and the secondserial processing apparatus 13, their constituent processing apparatusesare similar in processing capacity as shown in FIG. 6.

[0050] If apparatuses with different processing capacities should besimply integrated into one serial processing apparatus for flow shopprocess, a processing apparatus with a low processing capacity (the wirebonder 7 in this case; see FIG. 6) would determine the overallprocessing capacity of the integrated or serial processing apparatus andan apparatus with a higher processing capacity (the dicing apparatus 2and the coating apparatus 3 in this case) could not be effectively used.

[0051] Therefore, in order to take full advantage of the high capacitiesof the dicing apparatus 2 and coating apparatus 3, they are independentfrom the serial processing apparatuses and shared with the existing jobshop line.

[0052] Also, the molding apparatus 4, the processing capacity of whichshould differ depending on the number of products per mold as specifiedfor each product type, is independent from the serial processingapparatuses so that processing capacity discrepancy in the serialprocessing apparatuses can be avoided even when the product type ischanged.

[0053] In the serial processing apparatus which consists of the diebonder 5, clean cure unit 6 and wire bonder 7, plural wire bonders 7(which has a low processing capacity) may be installed to balance theprocessing capacities of different steps.

[0054] Thus, the flagship line 1 in this embodiment uses serialprocessing apparatuses which combine processing units with similarprocessing capacities.

[0055] The QFP 20 as an example of a semiconductor device to beassembled by the flagship line 1 will be explained next (see FIG. 12).The device comprises: a semiconductor chip 21 which bears asemiconductor integrated circuit on its main surface; a tab 22 to whichthe semiconductor chip is fixed; die bond 23 which joins thesemiconductor chip 21 to the tab 22; plural metal wires 24 whichelectrically connect an electrode pad 21 a on the main surface of thesemiconductor chip 21 with a corresponding inner lead 25; plural outerleads 26 which are integrally joined with the inner lead 25 and functionas external terminals; and a plastic mold 27 which molds thesemiconductor chip 21 and wires 24 with mold resin, where the outerleads 26 are bent into a gull wing shape outside the plastic mold 27.

[0056] Next, the first serial processing apparatus 8 and the secondserial processing apparatus 13 will be described in detail.

[0057] As shown in FIG. 2, the first serial processing apparatus 8comprises a die bonder 5, a clean cure unit 6, and wire bonders 7 (forexample, one die bonder, one clean cure unit 6, and nine wire bonders7), and a frame as a workpiece to be processed is carried by a frameconveyor line 17.

[0058] The number of wire bonders is not limited; it should depend onthe number of outer leads (external terminals) 26 of the QFP 20. It isalso possible to use a plurality of die bonders 5 or a plurality ofclean cure units 6. The numbers of die bonders 5 and clean cure units 6should also depend on the number of outer leads 26 of the QFP 20. Thenumbers of die bonders 5, clean cure units 6 and wire bonders 7 shouldbe determined so that their processing capacities are balanced.

[0059] The first serial processing apparatus 8 should be able to beprepared quickly to run independently. The frame conveyor line 17 shouldnot be monolithic but should consist of several blocks wheneverpossible. It lies behind the wire bonders 7 so that it can be rearrangedto cope with change in the number of wire bonders 7 or the layout.

[0060] The conveyor line need not be readjusted while a group of leadframes is being processed.

[0061] In the first serial processing apparatus 8, a loader unit 14 liesbetween the clean cure unit 6 and the wire bonders. When a frame isloaded from the clean cure unit 6 into the loader unit 14, the frame isplaced in a magazine 16.

[0062] In other words, the die bonder 5 and the clean cure unit 6process fames on a frame-by-frame basis; then, when moving frames fromthe clean cure unit 6 into the loader unit 14, they are placed in themagazine 16 before being loaded in to the loader unit 14.

[0063] The wire bonders 7 receive the magazine and take out the framesfrom the magazine 16 to perform wire bonding on them.

[0064] In the first serial processing apparatus 8, an unloader unit 15is provided at the line end and also another unloader unit 15(intermediate unloader unit) is provided between two neighboring wirebonders 7.

[0065] In other words, in the first serial processing apparatus 8, thereare plural unloader units 15 including the intermediate unloader unitlocated halfway in the row of wire bonders and the number of unloaderunits 15 is smaller than the number of wire bonders 7.

[0066] The presence of the intermediate unloader unit 15 located halfwayin the row of wire bonders means that frames can be unloaded there andsent to the molding apparatus 4.

[0067] Thus, in the first serial processing apparatus 8 according tothis embodiment, frames as workpieces to be processed can be unloaded bythe unloader units 15 located at two places.

[0068] This makes it possible to adjust the design cycle time among thedie bonder 5, clean cure unit 6 and wire bonders 7 to increase theoperation rate of the first serial processing apparatus 8 and improvethroughput.

[0069] As illustrated in FIG. 9(a), the magazines which house frames canbe loaded halfway in the row of wire bonders, and also as illustrated inFIG. 9(b), the magazines which contain frames can be unloaded halfway inthe row of wire bonders. Therefore, if a problem occurs in the diebonder 5 or clean cure unit 6, the operation rate of the first serialprocessing apparatus 8 will not decline.

[0070] Since the processing capacities of the die bonder 5 and the cleancure unit 6 are higher than the processing capacity of the wire bonders7, frames (magazines) may accumulate in the loader unit 14. In such acase, the magazines which house frames can be unloaded halfway in therow of wire bonders so that wire bonding can be done on the frames bystandalone wire bonders 43 independent from the first serial processingapparatus 8, as shown in FIG. 5.

[0071] Therefore, it is possible that mass-produced products (mainproducts) and urgently needed products are preferentially processed bythe first serial processing apparatus 8 and other products are firstsubjected to the steps of clean cure in the first serial processingapparatus 8 and then wire bonding is performed by the standalone wirebonders 43.

[0072] This means that the first serial processing apparatus 8 may alsobe used as a standalone wire bonder and also as a combination apparatusfor die bonding and clean cure.

[0073] As illustrated in FIG. 2, in the first serial processingapparatus 8 with plural wire bonders 7, it is a prerequisite that thenumber of wire bonders located after the intermediate unloader unit 15or remoter from the clean cure unit in the frame conveying direction 38is larger than the number of wire bonders 7 between the clean cure unit6 and the intermediate unloader unit 15.

[0074] In this embodiment, five of the nine wire bonders 7 are locatedafter the intermediate unloader unit 15 or remoter from the clean cureunit and the remaining four wire bonders 7 are located between the cleancure unit 6 and the intermediate unloader unit 15. That is, the numberof the remoter wire bonders 7 (located after the intermediate unloaderunit 15) is one larger the number of the nearer wire bonders 7.

[0075] This means that preparations or initial setup for a next producttype can be started on the nearer four wire bonders 7 between the loaderunit 14 and the intermediate unloader unit 15 as the last workpiece(frame) passes through the intermediate unloader unit 15.

[0076] Consequently, the number of loader units 14 and the number ofunloader units 15 may be decreased to improve throughput and reduce thecost of the manufacturing line.

[0077] It is also possible that the nearer four wire bonders (betweenthe clean cure unit 6 and the intermediate unloader unit 15) and theremoter five wire bonders (between the intermediate unloader unit 15 andthe end unloader unit 15) carry out wire bonding on different types ofworkpieces (frames) concurrently.

[0078] Furthermore, in the first serial processing apparatus 8, framescan be accumulated on the frame conveyor line 17.

[0079] Next, the second serial processing apparatus 13 as shown in FIG.13 is described.

[0080] The second serial processing apparatus 13 comprises a markingunit 9, a cutting unit 10, a testing unit (which also serves as ahandler) 11, a visual inspection unit 12, and an unloader unit 15. Itsequentially performs the following steps (flow shop process): marking,cutting, testing and visual inspection.

[0081] In the second serial processing apparatus 13 (FIG. 3) accordingto this embodiment, two test heads can be mounted in the testing unit 11as shown in FIG. 4.

[0082] In the testing unit 11 (handler), testing can be made using twotest heads (a first test head 11 a and a second test head 11 b).

[0083] The processing capacities of the marking unit 9 and the cuttingunit 10 are preset so that two QFPs are processed, for example, in 2.5seconds and the capacities for handling and visual inspection are presetto match them.

[0084] In the second serial processing apparatus 13 (FIG. 3), marking isfirst done by the marking unit 9, then lead cutting is done by thecutting unit 10 to make separate chips, and the separate chips ordevices 11 j are carried into the testing unit 11 through a workpieceflow path 11 j.

[0085] In the testing unit 11, devices 11 j which are carried and housedin a first tray 11 c are tested (a defective device is marked with across) and devices marked with a cross on the surface of the plasticmold 27 (FIG. 12) are selected and housed in a second tray 11 d. Devices11 j marked with a cross are devices which have been judged as defectiveat the wire bonding or molding step and carried into the testing unit11. In the testing unit 11, such defective devices 11 j are moved intothe second tray 11 d.

[0086] Then, two devices not marked with a cross are carried to each ofthe first test head 11 a and the second test head 11 b and these fourdevices 11 j are simultaneously tested by the first test head 11 a andthe second test head 11 b. Functional tests (for example, Function, DC,FT tests) are conducted on the four devices 11 j with the two test headsfor approximately five seconds.

[0087] Then, devices which have passed the functional tests are carriedto the visual inspection unit 12 and measured in terms of marking, leadpitch and flatness. Devices 11 j which have been rejected by thefunctional tests are moved into a sixth tray 11 h for functionallydefective devices.

[0088] Regarding devices 11 j which have undergone a visual inspection,accepted devices are put in a fourth tray 11 f and rejected or defectivedevices are put in a fifth tray 11 g.

[0089] Thus, the fifth tray 11 g is used for visually defective devicesand the sixth tray 11 h is used for functionally defective devices.

[0090] If the proportion of functionally defective devices is 3% or moreand the proportion of visually defective devices is 1% or more,functionally defective ones and visually defective ones are respectivelyput in a second tray 11 d and a third tray 11 e and subjected to avisual inspection and functional testing again.

[0091] In order to match the processing capacity of the visualinspection unit 12 with that of the testing unit 11, images from the twolines are alternately picked up in carrying devices 11 j.

[0092] In the flagship line 1 according to this embodiment, theprocessing capacity of the first serial processing apparatus 8 (FIG. 2)is larger than that of the second serial processing apparatus 13 (FIG.3), as illustrated in FIG. 10.

[0093] This is because processing time variation in the first serialprocessing apparatus 8 is smaller.

[0094] Therefore, as illustrated in FIG. 10, in the flagship line 1according to this embodiment, it is also possible that while a mainproduct (for example, a mass produced or core product) is processed in aflow shop line provided by the first serial processing apparatus 8 andthe second serial processing apparatus 13, concurrently a small lotproduct is first processed in a flow shop line provided by the firstserial processing apparatus 8 and then in a job shop line provided by astandalone marking unit 44, a standalone cutting unit 45, a standalonetesting unit 46, and a standalone visual inspection unit 47.

[0095] In the testing unit 11, when test items are added and it takeslonger time to test the main product, additional test heads may be usedto test, for example, eight devices 11 j at a time.

[0096] In this case, if it takes longer time to test a non-main product,devices (workpieces) may be processed not by the second serialprocessing apparatus 13 but in the job shop line.

[0097] Besides, in the second serial processing apparatus 13, if themarking unit 9 and the cutting unit 10 fail, it is possible to use onlythe testing unit 11; on the other hand, if the testing unit 11 fails, itis possible to use only the marking unit 9 and the cutting unit 10.

[0098] In the flagship line 1 according to this embodiment, the firstserial processing apparatus 8 and second serial processing apparatus 13(which constitute a flow shop line) are combined with the dicingapparatus 2, molding apparatus 4 and coating apparatus 3 (whichconstitute a job shop line) to perform the processing sequence as shownin FIG. 11 to assemble the QFP 20 (FIG. 12).

[0099] Referring to FIG. 1, a process start support system 18 which usesthe flagship line 1 according to this embodiment is explained below.

[0100] In the process start support system 18, data from various stepsof the flagship line 1 is sent to a host computer 19 and instructionsfor starting the manufacturing process for a new product, which arebased on the data, are sent from the host computer 19 to various stepsor processing apparatuses.

[0101] In other words, this is a management system which keeps track ofworkpieces to know which workpieces are in which step or in whatcondition and optimize the flow of workpieces.

[0102] Concretely, it has the following functions: to predetermine awork schedule; to give instructions for a product to be manufacturednext; to estimate time of arrival of workpieces from the preceding step;to check the progress of the process and order the preceding step tostart; to observe the overall process condition and order the step ofwafer mounting/dicing as the initial step (step 1) to load asemiconductor wafer; to give an alarm to a stagnant flow of workpieces;to do first-in first-out management; to preannounce setup for a nextproduct type and make workpieces in various steps flow smoothly, and soon.

[0103]FIG. 8 shows a case that a problem occurs in the second serialprocessing apparatus 13 and an instruction for offline operation isgiven. Here, the host computer 19 sends to a processing apparatus in thejob shop line (for example, the standalone marking unit 44) aninstruction to switch the ongoing flow shop process to an offline jobshop process (in the existing line 40) so that the process goes oncontinuously or without halting the flagship line 1.

[0104]FIG. 7 shows a work schedule which gives priority to the serialprocessing line. For example, an instruction to give priority to theserial process is sent from the host computer 19 to the coatingapparatus 3.

[0105]FIG. 7 is a time chart showing a lot-by-lot schedule in asituation that the steps in the flagship line 1 and the steps in the jobshop line (existing line 40) take place concurrently. In the flagshipline 1, the following steps are performed sequentially: dicing 28,preparation for die bonding 29, first serial processing 30 by the firstserial processing apparatus 8 (die bonding, clean cure, wire bonding),mold preparation 31, molding 32, coating 33, second serial processing 34by the second serial processing apparatus 13 (marking, lead cutting,testing, visual inspection), unloading 35 and check/packing 36.

[0106] In the job shop line (existing line 40), the steps of dicing, diebonding and clean cure (not shown) are performed, which is followed bythe steps of wire bonding 37, mold preparation 31, molding 32 andcoating 33.

[0107] Shown here is an example that the step of coating 33 in theflagship line 1 is carried out for every three lots which have underwentthe step of molding 32. On the other hand, in the job shop line(existing line 40), coating 33 is carried out for every lot.

[0108] As shown in FIG. 7, after molding 32 is carried out for threelots (first to third lots) in the flagship line 1, coating 33 is carriedout for them; if the schedule should not be changed, the step of coating33 in the flagship line 1 would overlap the step of coating 33 in theconcurrently ongoing job shop line, at point P.

[0109] Therefore, about two hours before completion of molding on thethird lot in the flagship line 1, the host computer 19 sends aninstruction to change the time of coating 33 in the job shop line(existing line 40) from point P to point Q, to the coating apparatus 3.

[0110] Similarly, the time of coating 33 is changed from point R topoint S.

[0111] In this way, the process start support system 18 in thisembodiment allows the whole facility to work efficiently with priorityon the serial processing line, without a decline in the operation ratesof the processing apparatuses.

[0112] Thus, even if a need to deal with an unscheduled product arises,serial processing for the unscheduled product may be preferentiallyperformed by the first serial processing apparatus 8 and second serialprocessing apparatus 13.

[0113] In the example shown in FIG. 7, the time required to carry outthe process from die bonding to wire bonding for one lot in the existingline 40 is substantially shortened by the use of the flagship line 1.

[0114] This is because the time and labor required to make a connectionbetween independent processing apparatuses are saved by using the firstserial processing apparatus 8 and second serial processing apparatus 13,and the nine wire bonders 7 in the first serial processing apparatus 8run concurrently.

[0115] Because of an unscheduled product or an apparatus failure, theinitial schedule may have to be updated (rescheduling).

[0116] An instruction for rescheduling is sent before wafer loading orwire bonding for each diffusion lot (ten assembly lots) or for eachassembly lot.

[0117] For an apparatus like the coating apparatus 3 which tends to failfrequently, the flagship line 1 may be designed to include preventivemaintenance in which the apparatus is inspected according to predictionof an apparatus failure cycle.

[0118] Specifically, it is possible that the failure cycle of eachprocessing apparatus is predicted and instructions to systematicallystop each apparatus and make it offline according to the prediction maybe sent from the host computer 19 to the apparatuses beforehand in orderto manufacture semiconductor devices without a decline in the operationrates of the apparatuses.

[0119] Consequently, in the flagship line 1 according to thisembodiment, the possibility of a stagnant flow of workpieces betweensteps is minimized and the time required for each step is substantiallyshortened.

[0120] In a conventional manufacturing line which consists of standaloneapparatuses each having a loader unit 14 and an unloader unit 15, eachprocessing apparatus is more expensive and more installation space isrequired, which means a higher cost and a larger processing facility.

[0121] By contrast, in the flagship line 1 according to this embodiment,the number of loader units 15 and unloader units 15 for each apparatuscan be decreased by using a plurality of serial processing apparatuses(in this example, the first serial processing apparatus 8 and secondserial processing apparatus 13) and thus the initial investment cost canbe reduced.

[0122] The use of serial processing apparatuses makes the entirefacility compact and improves space productivity.

[0123] Thus, a low cost space-saving facility can be realized.

[0124] In the conventional manufacturing facility, which products comenext is unknown at each step and a certain number of products have to beaccumulated before proceeding to the next step. On the other hand, inthe process start support system 18 based on the flagship line 1according to this embodiment, the flow of products is monitored so thatwhich products are in which step and in what condition are grasped andinstructions are given appropriately to prepare for the start of aprocess. Hence, the process start time can be appropriately determinedand initial setup for product type change can be made in a timelymanner.

[0125] As a consequence, the possibility of a stagnant flow of productsin each step is minimized and the processing time can be substantiallyshortened.

[0126] One preferred embodiment of the invention which has been made bythe present inventor has been concretely explained so far. However, theinvention is not limited to the above embodiment; obviously it may beembodied in any other form without departing the spirit and scopethereof.

[0127] For example, although the flagship line 1 runs concurrently withthe existing line 40 in the above embodiment, the flagship line may runindependently.

[0128] Also, the above embodiment assumes that the semiconductor deviceto be manufactured is QFP 20, but it may be any other semiconductordevice as far as it can be assembled by the flagship line 1 describedabove in connection with the above embodiment.

[0129] Furthermore, although the flagship line 1 is configured for thelater stage of the entire semiconductor device manufacturing process(from dicing to visual inspection) in the above embodiment, instead theinvention may be applied to processing apparatuses for the earlier stageand the flagship line 1 may be configured for the early stage.

INDUSTRIAL APPLICABILITY

[0130] As discussed so far, the semiconductor device manufacturingmethod according to the present invention is suitable for asemiconductor device manufacturing line using a serial processingapparatus which performs a series of steps sequentially and particularlysuitable for a manufacturing line which combines plural standaloneprocessing apparatuses and serial processing apparatuses.

What is claimed is:
 1. A method of manufacturing a semiconductor devicehaving a manufacturing sequence comprising: a flow shop process ofsequentially performing a series of plural different steps; and a jobshop process of providing a plurality of processing apparatuses of akind and concurrently performing processing of different conditions,wherein, in a process in said manufacturing sequence, either said flowshop process or said job shop process or both are performed, and saidmanufacturing sequence combines said flow shop process and said job shopprocess.
 2. The method of manufacturing a semiconductor device accordingto claim 1, wherein a loader unit is provided at the joint between saidflow shop process and said job shop process and, when a workpiece istransferred between said flow shop process and said job shop process,said workpiece is moved into said loader unit.
 3. The method ofmanufacturing a semiconductor device according to claim 1, wherein aserial processing apparatus performs a series of plural different stepsin said flow shop process.
 4. The method of manufacturing asemiconductor device according to claim 3, wherein said serialprocessing apparatus sequentially performs die bonding, clean cure andwire bonding.
 5. The method of manufacturing a semiconductor deviceaccording to claim 3, wherein said serial processing apparatussequentially performs marking, cutting, testing and visual inspection.6. The method of manufacturing a semiconductor device according to claim1, wherein said manufacturing sequence uses two different types of saidserial processing apparatuses and three different types of job shopprocess apparatuses, and one of said two serial processing apparatusesas a first serial processing apparatus performs die bonding, clean cure,and wire bonding and the other as a second serial processing apparatusperforms marking, cutting, testing and visual inspection, and said threejob processing apparatuses respectively perform dicing, molding, andcoating.
 7. The method of manufacturing a semiconductor device accordingto claim 6, wherein the number of wire bonders in said first serialprocessing apparatus is varied depending on the number of externalterminals of said semiconductor device.
 8. A method of manufacturing asemiconductor device having a manufacturing sequence comprising: a flowshop process of sequentially performing a series of plural differentsteps; and a job shop process of providing a plurality of processingapparatuses of a kind and concurrently performing processing ofdifferent conditions, wherein in a process in said manufacturingsequence, either said flow shop process or said job shop process or bothare performed, said manufacturing sequence combines said flow shopprocess and said job shop process, and for said flow shop process aserial processing apparatus is used to assemble a main product while forsaid job shop process, job processing apparatuses are used to assemble asmall-lot product.
 9. A method of manufacturing a semiconductor devicehaving a manufacturing sequence comprising: a flow shop process ofsequentially performing a series of plural different steps; and a jobshop process of providing a plurality of processing apparatuses of akind and concurrently performing processing of different conditions,wherein in a process in said manufacturing sequence, either said flowshop process or said job shop process or both are performed, saidmanufacturing sequence combines said flow shop process and said job shopprocess, two different types of serial processing apparatuses are usedto perform said flow shop process and said job shop process is performedbetween said two flow shop processes.
 10. A method of manufacturing asemiconductor device having a manufacturing sequence comprising: a flowshop process of sequentially performing a series of plural differentsteps; and a job shop process of providing a plurality of processingapparatuses of a kind and concurrently performing processing ofdifferent conditions, wherein in a process in said manufacturingsequence, either said flow shop process or said job shop process or bothare performed, said manufacturing sequence combines said flow shopprocess and said job shop process, a serial processing apparatus is usedto perform said flow shop process, and when said semiconductor device isan unscheduled product, said serial processing apparatus preferentiallyperforms processing for said unscheduled product.
 11. A method ofmanufacturing a semiconductor device having a manufacturing sequencecomprising: a flow shop process of sequentially performing a series ofplural different steps; and a job shop process of providing a pluralityof processing apparatuses of a kind and concurrently performingprocessing of different conditions, wherein in a process in said seriesmanufacturing sequence, either said flow shop process or said job shopprocess or both are performed, said manufacturing sequence combines saidflow shop process and said job shop process, and a serial processingapparatus having at least one loader unit is used for said flow shopprocess.
 12. The method of manufacturing a semiconductor deviceaccording to claim 11, wherein said first serial processing apparatus iscomprised of a die bonder, a clean cure unit, and a wire bonder, saidloader unit is located between said clean cure unit and said wirebonder, and in transferring a workpiece from said clean cure unit tosaid loader unit, said workpiece is placed in a container and handled ona container basis.
 13. The method of manufacturing a semiconductordevice according to claim 11, wherein said first serial processingapparatus has a plurality of wire bonders and a clean cure unit, anunloader unit is located between two neighboring ones of said pluralwire bonders, and in said plural wire bonders, the number of wirebonders located after said unloader unit, or remoter from said cleancure unit, is larger than the number of wire bonders located betweensaid unloader unit and said clean cure unit.
 14. A method ofmanufacturing a semiconductor device having a manufacturing sequencecomprising: a flow shop process of sequentially performing a series ofplural different steps; and a job shop process of providing a pluralityof processing apparatuses of a kind and concurrently performingprocessing of different conditions, wherein in a process in saidmanufacturing sequence, either said flow shop process or said job shopprocess or both are performed, and said manufacturing sequence combinessaid flow shop process and said job shop process, wherein said flow shopprocess includes first serial processing and second serial processing,said first serial processing including die bonding, clean cure and wirebonding and said second serial processing including marking, cutting,testing and visual inspection, and wherein the processing capacity of afirst serial processing apparatus for performing said first serialprocessing is larger than that of a second serial processing apparatusfor processing said second serial processing.
 15. The method ofmanufacturing a semiconductor device according to claim 14, wherein amain product is assembled by said first serial processing and asmall-lot product is assembled by job shop process which corresponds tosaid first serial processing.
 16. A method of manufacturing asemiconductor device having a manufacturing sequence comprising: a flowshop process of sequentially performing a series of plural differentsteps; and a job shop process of providing a plurality of processingapparatuses of a kind and concurrently performing processing ofdifferent conditions, wherein in a process in said manufacturingsequence, either said flow shop process or said job shop process or bothare performed, and said manufacturing sequence combines said flow shopprocess and said job shop process, wherein said flow shop processincludes first serial processing and second serial processing, saidfirst serial processing including die bonding, clean cure and wirebonding and said second serial processing including of marking, cutting,testing and visual inspection, and wherein a testing unit which performssaid testing uses a plurality of test heads.
 17. A method ofmanufacturing a semiconductor device having a manufacturing sequencecomprising: a flow shop process of sequentially performing a series ofplural different steps; and a job shop process of providing a pluralityof processing apparatuses of a kind and concurrently performingprocessing of different conditions, wherein in a process in saidmanufacturing sequence, either said flow shop process or said job shopprocess or both are performed, and said manufacturing sequence combinessaid flow shop process and said job shop process, and wherein data froma main process in said manufacturing sequence is sent to a control meansand according to this data, instructions for a product for which amanufacturing process is to be started are sent from said control meansto processing apparatuses in said main process in said manufacturingsequence.
 18. The method of manufacturing a semiconductor deviceaccording to claim 17, wherein an instruction for wafer input is givento a dicing unit for dicing as a first step in said manufacturingsequence.
 19. The method of manufacturing a semiconductor deviceaccording to claim 17, wherein an instruction to give priority to serialprocessing for said flow shop process in said manufacturing sequence issent to job processing apparatuses in said job shop process.
 20. Themethod of manufacturing a semiconductor device according to claim 17,wherein if a problem occurs in a serial processing apparatus whichperforms said flow shop process in said manufacturing sequence, aninstruction to make steps performed by said serial processing beperformed by said job shop process is sent to job processing apparatusesin said job shop process.
 21. The method of manufacturing asemiconductor device according to claim 17, wherein in saidmanufacturing sequence, at least any one of a serial processingapparatus responsible for said flow shop process and a job processingapparatus responsible for said job shop process is stopped on purposeand upon this stop, an instruction to start a process is sent to anoffline job processing apparatus.
 22. A method of manufacturing asemiconductor device having a manufacturing sequence comprising: a flowshop process of sequentially performing a series of plural differentsteps; and a job shop process of providing a plurality of processingapparatuses of a kind and concurrently performing processing ofdifferent conditions, said method comprising the steps of: (a) dicing asemiconductor wafer into chips as said job shop process; (b) after saidstep (a), sequentially performing die bonding, clean cure and wirebonding for semiconductor chips by a first serial processing apparatusas said flow shop process; (c) after said step (b), plastic-molding saidsemiconductor chips as said job shop process; (d) after said step (c),coating external terminals as said job shop process; and (e) after saidstep (d), sequentially performing marking, cutting, testing and visualinspection as said flow shop process by a second serial processingapparatus, wherein said flow shop process and said job shop process arecombined to assemble a semiconductor device through said manufacturingsequence.